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STATS ChipPAC
Looking for an organized, adaptable and driven NPI Engineer/Senior NPI Engineer to manage customer qualification of next-generation Wafer Level Packaging (WLP) devices— Fan-In and Fan-Out packages.
This position is project and program-management focused. You will serve as the central driver for new WLP products from early development, qualification and release for mass production. You will be working directly with external customers, process engineering, operations team and other support groups to ensure smooth and timely execution of qualification milestones.
You will own the qualification roadmap, manage customer communications, track critical path deliverables, and proactively mitigate risk.
Fresh grads are welcome to apply.
Singaporean and PRs only.
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