Engineering Project Manager (PIC) Fabrication

We are seeking a highly motivated and detail-oriented Engineering Project Manager (EPM) to drive development and fabrication of our next-generation Photonic Integrated Circuits (PICs). In this role, you will bridge the gap between cutting-edge optoelectronic design, our new photonic chip manufacturing facility, and system integration teams.

You will coordinate cross-functional efforts to deliver high-performance PICs to power the world's fastest AI data center fabrics and coherent transport networks. This is an ideal role for one looking to accelerate their career in deep-tech hardware delivery.

Key Responsibilities

• HOW YOU WILL CONTRIBUTE AND WHAT YOU WILL LEARN Project Execution & Lifecycle Management: Own the execution schedule, milestones, and deliverables for PIC fabrication projects.
• Cross-Functional Coordination: Facilitate daily synchronization between optical design engineers, mask layout teams, internal fabrication operations, packaging specialists, and product management.
• Tool and Process Alignment: Partner closely with internal fabrication engineering teams and dedicated processing tool owners to optimize hardware queues, schedule critical preventative maintenance, and prevent line bottlenecks during engineering runs.
• Risk & Bottleneck Management: Proactively identify critical path dependencies, technical roadblocks, processing tool constraints, and material supply risks.
• Project Reporting: Maintain clear project dashboards.
• Communicate technical status, resource constraints, and key metrics regularly to senior leadership and engineering stakeholders.

Required Qualifications

KEY SKILLS AND EXPERIENCE Education

• Bachelor’s, Master’s, or Ph.D. Degree in Engineering, Physics, Optics, Materials Science, or a related technical/science discipline.
• Experience: Minimum of 5+ years of professional experience in a hardware engineering, product development, or project management role.
• Project Management Fundamentals: Proven experience managing project timelines, organizing complex technical deliverables, and utilizing project management software (e.g., Smartsheet, Jira). Communication: Exceptional verbal and written communication skills, with a demonstrated ability to translate complex hardware status into structured, actionable project updates.
• Preferred & Desired Attributes Basic understanding of semiconductor manufacturing environments, cleanroom protocols, and the operational cadence of dealing with processing tools and wafer-handling coordination.
• Analytical Thinking: Skills to analyze requirements for completeness, consistency, and feasibility.
• Familiarity with semiconductor design lifecycles, particularly tape-out processes, cleanroom assembly, testing, or packaging.
• Direct exposure to InP substrates, fabrication processes, coherent optical subsystems, or fiber-optic communications systems is a significant plus, though strong execution skills remain the primary focus.
• An agile mindset with the ability to navigate shifting priorities in a fast-paced, R&D-heavy semiconductor environment.

What We Offer

At Nokia, we offer a collaborative, technically rigorous environment where you will collaborate with world-renowned experts in physics and networking infrastructure. You will receive competitive compensation, comprehensive benefits, and direct exposure to the technologies defining the next decade of computing infrastructure.

Some of our benefits in US: Corporate Retirement Savings Plan Health and dental benefits Short-term disability, and long-term disability Life insurance, and AD&D – Company paid 2x base pay Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child) Paid time off for holidays and Vacation Employee Stock Purchase Plan Tuition Assistance Plan Adoption assistance Employee Assistance Program/Work Life Resource Program