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QuantumScape
Thermal / Mechanical Engineer – Integrated Rack Power Platform
Location: San Jose, CA (On-site)
Reports To: Head of Engineering, Data Center Power Platform
We are building an integrated PSU + BBU rack power shelf that combines power conversion and solid-state battery backup into a single high-density platform for hyperscale AI data centers.
This shelf must conform to OCP Open Rack / ORv3 mechanical specifications, manage two thermally incompatible subsystems within a shared enclosure, and pass hyperscaler qualification—where mechanical and thermal design are just as critical as electrical performance.
As the Thermal / Mechanical Engineer, you will own the complete physical design of the product. You will translate circuit boards and battery packs into a manufacturable shelf that fits industry-standard racks, survives demanding data center environments, and can be serviced by a technician in seconds.
Design the complete mechanical enclosure (1OU or 2OU shelf) using SolidWorks or Creo, including:
Sheet metal chassis
Busbar routing
Internal structural supports
External connector interfaces
High-power semiconductors and magnetics operating at 100–125°C junction temperatures
Solid-state battery cells requiring sub-45–60°C operating temperatures
Directed airflow paths
Thermal isolation zones
Heat spreaders
Fan selection
Ansys Icepak
FloTHERM
6SigmaET
Full electrical load
35–40°C inlet air (ASHRAE A1/A2)
Fan degradation scenarios
Shelf width and depth
Connector positioning
Front-to-back airflow
Ejector handle placement
Guide rail interfaces
Weight-per-OU limitations
Proper insertion/extraction force curves
Blind-mate power connector alignment
Guide rail compliance
Tool-less serviceability
Cell pack mounting
Compression systems
Thermal interface materials
Mechanical isolation within the enclosure
ISTA 3-Series shipping requirements
GR-63-CORE (Bellcore Zone 4) seismic requirements
Lead Design for Manufacturing (DFM) activities with contract manufacturers, including:
Tolerances
Tooling
Bend radii
Spot welding
PEM fastener insertion
Assembly sequence optimization
Material selection (94V-0)
Component spacing
Enclosure integrity
Interface directly with hyperscaler mechanical integration teams throughout product qualification.
Rack-mounted power systems
Compute platforms
Telecom equipment
Ansys Icepak
FloTHERM
6SigmaET
Proficiency with SolidWorks or Creo for detailed mechanical design.
Extensive sheet metal design experience for high-volume manufacturing, including:
Bend radii
Punching and stamping
Spot welding
Tolerance stack-up analysis
Proven track record taking products through contract manufacturing and thermal validation in production or hyperscale data center environments.
Strong understanding of airflow management in forced-convection rack systems.
Direct experience with OCP Open Rack / ORv3 mechanical specifications.
Electric vehicles
Stationary energy storage
Telecom backup systems
Exposure to liquid cooling or cold plate design for next-generation rack power shelves.
Experience integrating blind-mate high-power connectors from manufacturers such as:
Amphenol
TE Connectivity
Molex
UL 62368-1 mechanical/flammability requirements
UL 1973 battery enclosure requirements
Knowledge of IP67 and NEMA ratings for edge or outdoor deployment variants.
ISTA 3-Series
GR-63-CORE
Why This Role Matters
Hyperscalers do not negotiate on rack geometry. If the shelf does not fit, does not cool effectively, or cannot be serviced in seconds, it will never be evaluated—regardless of how strong the electrical design is.
You will serve as the company's primary mechanical interface with hyperscaler qualification teams. Your understanding of both published and practical mechanical integration requirements can shorten qualification timelines by months.
In a product where high-power electronics and solid-state battery cells share the same enclosure, you are the engineer responsible for making that coexistence physically possible.
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